Job description
Job details
- Location: Austin, Travis County
- Work mode: Onsite
- Employment type: Full-time (Not an internship)
- Salary: USD 171,020 per year
Role overview
Amazon's Annapurna Labs is hiring a Package Layout Design Engineer to join their AI Silicon Packaging team in Austin, Travis County. This Senior-level, Full-time, Onsite role focuses on designing custom silicon packaging solutions that power AWS cloud infrastructure. The position offers a competitive salary of $171,020 USD and involves working on cutting-edge AI accelerator hardware that enables breakthrough cloud computing capabilities.
Job details
This is a Full-time, Onsite position located in Austin, Travis County. The role is with Annapurna Labs, Amazon's silicon design organization within AWS, and offers an annual salary of $171,020 USD. You will design package layouts for AI accelerators and custom chips that solve previously unimaginable technical challenges for AWS customers worldwide.
Responsibilities
- Design advanced package layouts for AI silicon and custom accelerators
- Collaborate with cross-functional hardware and software teams on chip integration
- Optimize package designs for signal integrity, thermal performance, and manufacturability
- Support silicon bring-up, validation, and production ramp activities
- Drive innovation in packaging solutions for next-generation AWS infrastructure
Requirements
- Bachelor's degree in Electrical Engineering, Computer Engineering, or related field
- 4+ years of experience in package layout design or silicon packaging engineering
- Proficiency with EDA tools for package design and signal integrity analysis
- Strong understanding of high-speed digital design and PCB layout principles
- Experience with advanced packaging technologies such as flip-chip, BGA, or 2.5D/3D integration
Benefits
- Competitive salary of $171,020 USD annually
- Comprehensive health and wellness benefits
- Work on cutting-edge AI and cloud infrastructure
- Career growth opportunities within AWS and Amazon